LS64-2
For printing matrices; for the manufacture of tapes, strips, rods
For printing matrices; for the manufacture of tapes, strips, rods
Standard | Fe, % | Bi, % | Cu, % | Zn, % | Sb, % | Pb, % | P, % |
---|---|---|---|---|---|---|---|
GOST 15527-2004 | < 0.1 | < 0.002 | 63–66 | 31.7–35.5 | < 0.005 | 1.5–2 | < 0.01 |
Standard | Description |
---|---|
GOST 15527-2004 | |
GOST 15527-70 | |
DSTU GOST 15527:2005 |
Parameter | Units of measurement | Description |
---|---|---|
$$E\cdot 10^{9}$$ | $$MPa$$ | Elastic modulus |
$$\alpha\cdot 10^{6}$$ | $$K^{-1}$$ | Coefficient of thermal (linear) expansion (range 20°C–T) |
$$\varkappa$$ | $$\frac{W}{m\cdot K}$$ | Coefficient of thermal conductivity (the heat capacity of the material) |
$$\rho$$ | $$\frac{kg}{m^3}$$ | The density of the material |
$$R\cdot 10^{-6}$$ | $$\Omega\cdot m$$ | Electrical resistivity |
Parameter | Units of measurement | Description |
---|---|---|
melting point | °C | The temperature at which solid crystalline body makes the transition to the liquid state and Vice versa |
annealing temperature | °C | The temperature at which the processes return recrystallization and homogenization of the metal to reduce its hardness for subsequent machining |