33NK (EP139, H33K17)
For compounds with ceramics, mica and glass.
for soldering with soft glass S72−4, for connection with ceramic and mica; 1000000 * TFLE at temperatures ranging from -70 to +450 ºC to 6 — 9 [1 / ºC]
For compounds with ceramics, mica and glass.
for soldering with soft glass S72−4, for connection with ceramic and mica; 1000000 * TFLE at temperatures ranging from -70 to +450 ºC to 6 — 9 [1 / ºC]