H15N60
for the manufacture of critical parts in-vacuum devices, electronic connectors technology products, for resistors nepretsizionnyh
for the manufacture of critical parts in-vacuum devices, electronic connectors technology products, for resistors nepretsizionnyh
Standard | Fe, % | Si, % | Mn, % | Cr, % | Ti, % | Ni, % | Al, % | P, % | C, % | S, % |
---|---|---|---|---|---|---|---|---|---|---|
Standard | Fe, % | Si, % | Mn, % | Cr, % | Ti, % | Ni, % | Al, % | P, % | C, % | S, % |
GOST 10994-74 | 17.3–29.2 | 0.8–1.5 | < 1.5 | 15–18 | < 0.3 | 55–61 | < 0.2 | < 0.03 | < 0.15 | < 0.02 |
Temperature, °C | E\cdot 10^{9}, MPa | \alpha\cdot 10^{6}, K^{-1} | \rho, \frac{kg}{m^3} | c\cdot 10^{-3}, \frac{J}{kg\cdot K} | R\cdot 10^{-6}, \Omega\cdot m |
---|---|---|---|---|---|
Temperature, °C | E\cdot 10^{9}, MPa | \alpha\cdot 10^{6}, K^{-1} | \rho, \frac{kg}{m^3} | c\cdot 10^{-3}, \frac{J}{kg\cdot K} | R\cdot 10^{-6}, \Omega\cdot m |
20 | 218 | 8200 | 1.1 | ||
100 | 17 | 0.46 |
Standard | Description |
---|---|
Standard | Description |
GOST 10994-74 |
Parameter | Units of measurement | Description |
---|---|---|
Parameter | Units of measurement | Description |
E\cdot 10^{9} | MPa | Elastic modulus |
\alpha\cdot 10^{6} | K^{-1} | Coefficient of thermal (linear) expansion (range 20°C–T) |
\rho | \frac{kg}{m^3} | The density of the material |
c\cdot 10^{-3} | \frac{J}{kg\cdot K} | The specific heat of the material (range 20°C–T) |
R\cdot 10^{-6} | \Omega\cdot m | Electrical resistivity |
Parameter | Units of measurement | Description |
---|---|---|
Parameter | Units of measurement | Description |
melting point | °C | The temperature at which solid crystalline body makes the transition to the liquid state and Vice versa |
Hot working temperature | °C | The temperature at which the plastic-deformed metal recrystallizes during the pressure treatment |
annealing temperature | °C | The temperature at which the processes return recrystallization and homogenization of the metal to reduce its hardness for subsequent machining |