POS61M (sn60pb38cu2)
For tinning and soldering electrosolderers thin (thickness less than 0.2 mm) copper wire, foil, printed conductors in the cable, electrical and electronic industries, as well as jewelry art. The use of solder when soldering and tinning in a crucible and bathrooms are not allowed. Alloy bessurmyanisty
Classification
Country |
Section |
Category |
CIS, Russia, Ukraine |
Tin, lead, babity |
Tin-lead solder |
Chemical composition
Standard |
Fe, % |
Sn, % |
Bi, % |
Cu, % |
Zn, % |
Ni, % |
Sb, % |
Al, % |
Pb, % |
As, % |
S, % |
GOST 21930-76 |
< 0.02 |
59–61 |
< 0.2 |
1.2–2 |
< 0.002 |
< 0.02 |
< 0.2 |
< 0.002 |
36.726–39.8 |
< 0.01 |
< 0.02 |
Information on suppliers
Physical characteristics
Temperature, °C |
$$\rho$$, $$\frac{kg}{m^3}$$ |
$$R\cdot 10^{-6}$$, $$\Omega\cdot m$$ |
20 |
8500 |
0.143 |
Mechanical properties at 20 °C
Rolling |
Standard |
Size, mm |
Tension |
Classifiers |
$$\sigma _{U}$$, $$MPa$$ |
$$\epsilon_L$$, % |
$$KCU\cdot 10^{3}$$, $$\frac{J}{m^2}$$ |
Treatment |
Alloy |
GOST 21930-76 |
|
|
|
45 |
40 |
110 |
|
Brinell hardness number
Casting and technological parameters
melting point, solidus, °C |
melting point, liquidus, °C |
183 |
192 |
Standards
Description of chemical elements
Element |
Units of measurement |
Description |
Fe |
% |
Iron |
Sn |
% |
Tin |
Bi |
% |
Bismuth |
Cu |
% |
Copper |
Zn |
% |
Zinc |
Ni |
% |
Nickel |
Sb |
% |
Antimony |
Al |
% |
Aluminium |
Pb |
% |
Lead |
As |
% |
Arsenic |
S |
% |
Sulfur |
Description of physical characteristics
Parameter |
Units of measurement |
Description |
$$\rho$$ |
$$\frac{kg}{m^3}$$ |
The density of the material |
$$R\cdot 10^{-6}$$ |
$$\Omega\cdot m$$ |
Electrical resistivity |
Description of mechanical properties
Parameter |
Units of measurement |
Description |
$$\sigma _{U}$$ |
$$MPa$$ |
Ultimate tensile strength |
$$\epsilon_L$$ |
% |
Elongation at break (longitudinal) |
$$KCU\cdot 10^{3}$$ |
$$\frac{J}{m^2}$$ |
Impact toughness |
Description of the casting and technological parameters
Parameter |
Units of measurement |
Description |
melting point, solidus |
°C |
The temperature at which melts the low melting component |
melting point, liquidus |
°C |
The temperature at which equilibrium falls first crystal |