Tin-lead solder 25C
It is used for tinning and soldering of electric and radio equipment, printed circuits, precision instruments with high-tight seams
Classification
| Country |
Section |
Category |
| CIS, Russia, Ukraine |
Tin, lead, babity |
Lead antimony alloys |
Chemical composition
| Standard |
Fe, % |
Sn, % |
Bi, % |
Cu, % |
Al, % |
Pb, % |
Cd, % |
|---|
| GOST 21930-76 |
< 0.02 |
24.5–25.5 |
< 0.1 |
< 0.05 |
< 0.001 |
74.328–75.5 |
< 0.001 |
Information on suppliers
Physical characteristics
| Temperature, °C |
$$\varkappa$$, $$\frac{W}{m\cdot K}$$ |
$$\rho$$, $$\frac{kg}{m^3}$$ |
$$R\cdot 10^{-6}$$, $$\Omega\cdot m$$ |
|---|
| 20 |
0.092 |
8900 |
0.145 |
Mechanical properties at 20 °C
| Rolling |
Standard |
Size, mm |
Tension |
Classifiers |
$$\sigma _{U}$$, $$MPa$$ |
$$\sigma_{Y}$$, $$MPa$$ |
d5, % |
Treatment |
|---|
| Wire |
GOST 21930-76 |
|
|
|
3.6 |
2.8 |
35–40 |
|
Brinell hardness number
| Rolling |
Standard |
Classifiers |
Value, HBW |
| Wire |
GOST 21930-76 |
|
13.8–14 |
Casting and technological parameters
| melting point, solidus, °C |
melting point, liquidus, °C |
|---|
| 140–145 |
155–160 |
Analogues
Standards
Description of chemical elements
| Element |
Units of measurement |
Description |
| Fe |
% |
Iron |
| Sn |
% |
Tin |
| Bi |
% |
Bismuth |
| Cu |
% |
Copper |
| Al |
% |
Aluminium |
| Pb |
% |
Lead |
| Cd |
% |
Cadmium |
Description of physical characteristics
| Parameter |
Units of measurement |
Description |
| $$\varkappa$$ |
$$\frac{W}{m\cdot K}$$ |
Coefficient of thermal conductivity (the heat capacity of the material) |
| $$\rho$$ |
$$\frac{kg}{m^3}$$ |
The density of the material |
| $$R\cdot 10^{-6}$$ |
$$\Omega\cdot m$$ |
Electrical resistivity |
Description of mechanical properties
| Parameter |
Units of measurement |
Description |
| d5 |
% |
Elongation at break |
| $$\sigma_{Y}$$ |
$$MPa$$ |
Yield strength |
| $$\sigma _{U}$$ |
$$MPa$$ |
Ultimate tensile strength |
Description of the casting and technological parameters
| Parameter |
Units of measurement |
Description |
| melting point, solidus |
°C |
The temperature at which melts the low melting component |
| melting point, liquidus |
°C |
The temperature at which equilibrium falls first crystal |